03-12-2025 Mains Question Answer
The India Semiconductor Mission (ISM), launched under the Ministry of Electronics and IT (MeitY), is a specialised and autonomous agency created to build a sustainable semiconductor and display ecosystem in India. It aims to reduce import dependence, enhance technological sovereignty, and position India as a global semiconductor manufacturing and design hub.
Challenges Faced by the Semiconductor Industry in India
- Infrastructure and Utility Constraints
- High Capital Requirement: A cutting-edge semiconductor fab requires USD 15–20 billion, making entry difficult.
- Water and Power Needs: A fab needs ~10 million litres/day of ultra-pure water and near-zero power outages, which many Indian industrial clusters lack.
- Logistics Limitations: Absence of specialised “chip corridors” and secure cold-chain-like transport systems for fragile wafers.
- Technology and R&D Limitations
- Restricted Access to Advanced Nodes: Due to export controls (e.g., US-Japan-Netherlands restrictions), India faces barriers in accessing sub-10 nm technologies.
- Weak IP Ecosystem: India relies heavily on foreign EDA tools and has limited indigenous semiconductor IP.
- Low R&D Investment: India spends <0.7% of GDP on R&D, insufficient for a tech-intensive industry.
- Supply Chain and Raw Material Dependencies
- Import Dependence: Nearly all semiconductor-grade gases, chemicals, wafers, and rare earths are imported.
- Absence of Upstream Ecosystem: India lacks domestic manufacturers of photolithography equipment, deposition machines, etc.
- Skilled Workforce Gap
- Shortage of highly trained engineers in fabrication technology, photonics, packaging, and materials science.
- India is strong in chip design, but weak in manufacturing talent.
- Global Geopolitical Challenges
- US–China chip rivalry affects technology transfer.
- Global firms are cautious about relocating supply chains to new geographies without proven stability.
Key Strategic Elements of the India Semiconductor Mission (ISM)
- Semiconductor Fabs and Display Fabs Scheme
- Support for setting up greenfield semiconductor fabs and display fabs through up to 50% fiscal support.
- Technology-agnostic incentives to attract leading global players.
- Design Linked Incentive (DLI) Scheme
- Incentives for domestic chip design companies.
- Financial support across three stages:
- Chip Design Infrastructure Support
- Product Design Linked Incentive
- Deployment Linked Incentive
- Semiconductor Labs, R&D, and Capacity Building
- Establishing Semiconductor R&D Accelerator with hubs at IIT Madras, IISc Bengaluru and other institutes.
- Focus on emerging areas like GaN, SiC, compound semiconductors, photonics, advanced packaging.
- Dedicated programs for developing 85,000+ trained professionals over the next decade.
- India as a Global Chip Packaging & ATMP Hub
- Promotion of Assembly, Testing, Marking and Packaging (ATMP/OSAT) units to integrate into global value chains.
- Micron’s ATMP facility in Gujarat is an early example.
- Trusted Semiconductor and Supply Chain Strategy
- Ensuring secure supply chains for defence, space, and critical infrastructure.
- Encouraging domestic sourcing of materials, specialty chemicals, gases, and equipment.
- International Partnerships and Strategic Collaboration
- Collaboration with the US, Japan, Taiwan, EU under frameworks like the India-US Initiative on Critical and Emerging Technologies (iCET).
- Technology transfer, skill-building, and joint research initiatives.
India’s semiconductor ambitions face structural challenges—high capital costs, skill shortages, technological barriers, and supply chain dependence. However, through the ISM’s comprehensive strategy encompassing manufacturing, design, R&D, packaging, talent development, and global partnerships, India aims to build a resilient semiconductor ecosystem. With sustained investment, policy stability, and collaboration, India can emerge as a trusted and competitive player in the global semiconductor value chain.